Technical analysis of pin and female connectors

1、 Definition and Basic Structure

Pin Header and Socket Connector is a core component used in electronic devices for signal transmission and power connection between circuit boards.

Structural composition:

Pin Header: Single or multiple rows of metal pins, mostly made of brass or phosphor bronze plated with gold/nickel, with standardized spacing (such as 2.54mm, 2.0mm).

Socket Connector: A socket corresponding to the pin arrangement, containing elastic contact pieces to ensure stability during insertion and removal.

Insulated base: usually made of high-temperature resistant plastic (such as PA, PBT), providing mechanical support and electrical isolation.

2、 Core Features

1. High density and modular design

Diversified spacing: Common spacing includes 2.54mm (standard), 2.0mm (compact), and 1.27mm (micro) to meet different circuit board space requirements.

Flexible pin count: up to 40 pins per row, expandable to 80 pins per double row, supporting complex circuit connections.

Stacking and expansion capability: By combining multiple sets of pin and mother arrangements, circuit boards can be vertically or horizontally stacked, simplifying equipment structure.

2. Excellent electrical performance

Current carrying capacity: Single contact rated current 1-3A (depending on coating thickness), high current models can reach 5A.

Voltage resistance level: Standard products can withstand 500V AC voltage, and special designs can reach up to 1000V.

Contact resistance: ≤ 20m Ω (gold-plated contacts) ensures low signal loss transmission.

3. Mechanical reliability

Insertion and extraction lifespan: ≥ 500 times (without locking structure), with a lock buckle design that can reach over 1000 times.

Vibration resistance: Tested according to MIL-STD-202G standard, suitable for in vehicle and industrial environments.

Anti misplacement design: Keyway positioning, shaped plastic casing or colored markings to prevent reverse insertion.

4. Environmental adaptability

Temperature range: -40 ℃~+105 ℃ (standard), high temperature models can reach+125 ℃.

Anti corrosion treatment: Gold plating (0.2-0.8 μ m) or tin plating, passed 48 hour salt spray test.

Flame retardant grade: UL94 V-0 grade substrate, meeting safety regulations.

3、 Comparison of key characteristics

Features: Header, Socket

Installation method: Welding to PCB board, welding or crimping cables

Contact type: rigid pin, elastic spring

Typical height 5.0mm (standard direct insertion) 8.5mm (with plastic shell)

Reinforcement design optional positioning column metal shell shielding

4、 Detailed explanation of application areas

1. Consumer electronics

Case: Smart home controller, drone flight control board.

Requirement: 2.0mm spacing pin arrangement for lightweight and gold plated contacts to ensure high-frequency signal integrity.

2. Industrial automation

Case: PLC module, sensor interface.

Requirement: Equipped with a locking buckle for the busbar (such as JST XH series) to prevent vibration and detachment, and made of high-temperature resistant material suitable for the workshop environment.

3. Communication equipment

Case: 5G base station RF module, fiber optic switch.

Requirement: Metal shielding shell busbar (such as Hirose DF11) suppresses electromagnetic interference and supports high-speed differential signals.

4. Automotive Electronics

Case: Car navigation host, BMS battery management system.

Requirement: Compliant with USCAR-2 standard, vibration resistant and dust-proof design (IP67 rating).

5. Medical equipment

Case: Portable monitor, endoscope control unit.

Requirement: Medical grade insulation material with low insertion and extraction force design for easy maintenance.

5、 Selection Guide

1. Parameter matching principle

Current/Voltage: Choose models above 3A for power lines and 1A standard for signal lines.

Frequency requirement: High frequency applications require attention to characteristic impedance (such as 50 Ω/100 Ω differential pairs).

Environmental factors: Prioritize gold plating in humid environments, and use LCP material base in high-temperature scenarios.

2. Installation precautions

PCB layout: Reserve 2mm edge spacing to avoid short circuits, and double row pins should be symmetrically arranged to prevent stress concentration.

Welding process: Recommended reflow soldering (peak temperature 260 ℃± 5 ℃), manual soldering time ≤ 3 seconds per pin.